User manual INTEL CORE 2 DUO MOBILE THERMAL DESIGN GUIDE 6-2008

[. . . ] Intel® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008 Order Number: 320028-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. [. . . ] Components placed between the underside of the heatsink and motherboard cannot exceed 4. 75 mm in height when using heatsinks that extend beyond the socket envelope shown in Figure 2 for the micro-FCPGA package. Intel® CoreTM 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG 11 June 2008 Order Number: 320028-001 Mechanical Specifications--CoreTM 2 Duo Mobile Processors Figure 2. Primary Side Keep Out Zone Requirements-- Micro-FCPGA Notes: 1. Dimension in millimeters [inches]. June 2008 Order Number: 320028-001 Intel® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications TDG 12 CoreTM 2 Duo Mobile Processors--Mechanical Specifications Figure 3. Primary Side Keep Out Zone Requirements-- Micro-FCBGA Notes: 1. Dimension in millimeters [inches]. Intel® CoreTM 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG 13 June 2008 Order Number: 320028-001 Mechanical Specifications--CoreTM 2 Duo Mobile Processors Figure 4. Secondary Side Keep Out Zone Requirements Notes: 1. Dimension in millimeters [inches]. June 2008 Order Number: 320028-001 Intel® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications TDG 14 CoreTM 2 Duo Mobile Processors--Thermal Solution Requirements 5. 0 5. 1 Thermal Solution Requirements Thermal Solution Characterization The thermal characterization parameter, ("psi"), is used to characterize thermal solution performance, as well as compare thermal solutions in identical situations (i. e. , heating source, local ambient conditions, etc. ). Junction-to-Local Ambient Thermal Characterization Parameter (JA) JA = TJ - TA TDP JA = Junction-to-local ambient thermal characterization parameter (°C/W) TJUNCTION MAX = Maximum allowed device temperature (°C) TA = Local ambient temperature near the device (°C) (see Section 7. 0, "Thermal Metrology" for measurement guidelines) TDP = Thermal Design Power (W) The thermal characterization parameter assumes that all package power dissipation is through the thermal solution (heatsink), and is equal to TDP. A small percentage of the die power (< 5%) is dissipated through the package/socket/motherboard stack to the environment, and should not be considered to be a means of thermal control. The junction-to-local ambient thermal characterization parameter, JA, is comprised of JS, which includes the thermal interface material thermal characterization parameter, and of SA, the sink-tolocal ambient thermal characterization parameter: Equation 2. Junction-to-Local Ambient Thermal Characterization Parameter JA = JS + SA Where: JS = Thermal characterization parameter from junction-to-sink, this also includes thermal resistance of the thermal interface material (TIM) (°C/W). SA = Thermal characterization parameter from sink-to-local ambient (°C/W) SA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. SA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 5 illustrates the combination of the different thermal characterization parameters. Intel® CoreTM 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG 15 June 2008 Order Number: 320028-001 Thermal Solution Requirements--CoreTM 2 Duo Mobile Processors Figure 5. Processor Thermal Characterization Parameter Relationships TA HEATSINK TIM SA TS TJ TIM JA Device 5. 1. 1 Calculating the Required Thermal Performance for the Intel® CoreTM2 Duo processor Overall thermal performance, JA, is then defined using the thermal characterization parameter: · Define a target component temperature TJUNCTION and corresponding TDP. The following provides an illustration of how to determine the appropriate performance targets. Assume: · TDP = 35 W and TJUNCTION = 105 °C · Local processor ambient temperature, TA = 40 °C. Using Equation 1, the maximum allowable resistance, junction-to-ambient, is calculated as: Equation 3. Maximum Allowable Resistance JA = TJ - TA 105 - 40 = = 1. 857 o C / W TDP 35 To determine the required heatsink performance, a heatsink solution provider would need to determine CA performance for the selected TIM and mechanical load configuration. If the heatsink solution were designed to work with a TIM material performing at TIM 0. 50 °C/W, solving from Equation 2, the performance of the heatsink required is: Equation 4. Required Performance of the Heatsink SA = JA - JS = 1. 86 - 0. 50 = 1. 36 o C / W June 2008 Order Number: 320028-001 Intel® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications TDG 16 CoreTM 2 Duo Mobile Processors--Thermal Solution Requirements It is evident from the above calculations that a reduction in the local ambient temperature can have a significant effect on the junction-to-ambient thermal resistance requirement. This effect can contribute to a more reasonable thermal solution including reduced cost, heatsink size, heatsink weight, or a lower system airflow rate. Table 3 summarizes the thermal budget required to adequately cool the Intel® CoreTM 2 Duo Mobile Processors on 45-nm process. Since the data is based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes. Required Heatsink Thermal Performance (JA) CPU Processor SKU Standard Voltage (Core 2 Duo-6M, Celeron-2M) Intel® CoreTM 2 Duo Mobile Processors on 45nm process Low Voltage (Core 2 Duo -3M) Ultra Low Voltage (Core 2 Duo -2M, Celeron) TDP (W) JA (ºC/W) at TA = 40 ºC 1. 86 JA (ºC/W) at TA = 55 ºC 1. 42 35 17 3. 82 2. 94 10 6. 5 5. 0 Notes: 1. [. . . ] The thermocouples should be placed approximately 3 mm to 8 mm [0. 1 to 0. 3 in. ] above the fan hub vertically and halfway between the fan hub and the fan housing horizontally as shown in Figure 13 (avoiding the hub spokes). · Using an open bench to characterize an active heatsink can be useful, and usually ensures more uniform temperatures at the fan inlet. However, additional tests that include a solid barrier above the test motherboard surface can help evaluate the potential impact of the chassis. This barrier is typically clear Plexiglas*, extending at least 100 mm [4 in. ] in all directions beyond the edge of the thermal solution. [. . . ]